Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/mK HTK-002-U1-GP

General Information for Cooler Master Thermal Paste

Cooler Master HTK-002. Type: Thermal paste, Thermal conductivity: 4.5 W/mK, Product colour: White. Quantity per pack: 1 pc(s), Package width: 102 mm, Package depth: 171 mm

HTK-002

Cooler Master HTK-002-U1 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability.

- Suitable for CPU, chipsets on Mainboard, VGA card, etc.
- Easy to use.
- Zif Socket Templates ensure correct applying area with various CPU socket types.
- Produces an even layer when using applicator.
- Dielectric.
- Wide range of application temperature.

These compounds resist changes in consistency at temperatures up to 177C (350F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

Colour
White

Volume
2g

Specific Gravity
2.37

Viscosity/Flowability
Non-Flowing

Shelf Life
24 months from DOM

Thermal Conductivity
0.8 watts/meter-C

Volume Resistivity
5.0 x 1015

Dielectric Constant
4.4 at 100k Hz

Dissipation Factor
0.02 at 100k Hz

Dielectric Strength
550 volts/mil; 21.7 kV/mm HTK-002

Further details for this product, HTK-002, can be found at the manufacturer website. Please note, these web addresse(s) are supplied by 3rd parties, Quzo UK is not responsible for the content.

0.8 °C/W, 550 volts/mil, 21.7 kV/mm

Cooler Master HTK-002. Type: Thermal paste, Thermal conductivity: 4.5 W/m·K, Product colour: White. Quantity per pack: 1 pc(s), Package width: 102 mm, Package depth: 171 mm

Initial Release Date: 29/06/2006

Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K HTK-002-U1-GP Specifications

Product Type Thermal Paste Collection Model Cooler Master HTK-002 Manufacturer Product Type Cooler Master Thermal Paste Product colour White Product Family HTK-002 Type Thermal paste Thermal resistance 0.8 C/W Year 2006 Thermal conductivity 4.5 W/mK Specific gravity 2.37 g/cm Quantity per pack 1 pc(s) Package depth 171 mm Package width 102 mm Package height 40 mm MPN HTK-002-U1-GP

Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K HTK-002-U1-GP Reviews

There are no reviews for this product.